3D Electronics
Browse the coming attractions at your local movie theater. How many 3D movies are being advertised? 3D is a very exciting technology for movie and TV watchers, and the future of it may...
View ArticleNo-Clean Solder Paste for Clip-bonding Die-Attach
I’m just back from Malaysia, where I visited one of our larger customers who has been using our high-lead (high-Pb) dispensable NC-SMQ75 solder paste for many years. No surprises there, but what many...
View ArticleLeadframe Solderability Issues in Power Semiconductors
It is no secret that automotive semiconductor customers are becoming increasingly demanding. The “under the hood / bonnet” electronics environment is arguably one of the most thermally stressful...
View ArticleManufacturing Indium with Pride
I recently caught up with Brent Boek, Supervisor of the indium cell at our Utica Business Park manufacturing facility in New York. Brent and his crew work hard to create all types of custom fabricated...
View ArticleMarcy Nanocenter Semiconductor Fab
You may remember that, a couple of years ago, I wrote an article for Chip Scale Review magazine about plans for a major semiconductor facility (the Marcy Nanocenter). Well, sometimes wishes DO come...
View ArticleRDSON and Solder Volume Resistivity
Interesting question from a Chinese die-attach customer this week asking about volume resistivity of solder. My friend, Eric Bastow, suggested that Indium make this available to all through a blog...
View ArticleRonnie Spraker and the World’s Only NanoFoil®/NanoBond® Production Team
Ronnie Spraker is the supervisor of our NanoFoil® production department. Everyday, Ronnie and his team make reactive foils that are used all over the world. In addition to making foil, Ronnie’s team...
View ArticleDartmouth Student Asks Questions About SACm™ Solder Alloy
Folks, Some years ago, a leading IC manufacturer decided that their R&D effort could benefit if analyzed for possible improvement – by hiring professionals from the arts (e.g. singers, actors,...
View ArticleAdvances in Semiconductor Packaging Workshop and Exhibition
In addition to being a Technical Support Engineer for Indium Corporation, I also work as the Student Chapter Liaison for the Empire State iMAPS chapter. This iMAPS chapter has an Advanced Technology...
View ArticleMetal Loading in Solder Paste - A Review (Part 1)
Three IPC test methods are used to guarantee to customers that they are getting the same material (within agreed tolerances). However one test has not changed in decades and almost always gives the...
View ArticleEvolving Semiconductor Assembly Challenges in 2019
2019 predictions for semiductor packaging and assembly based on global uncertainty on political and economic fronts.
View ArticleDriving the Packaging Frontier: Part 2
Indium Corporation’s Sze Pei Lim, talks about when to make th emove from water-soluble to no-clean fluxes for flip-chip assembly packages.
View ArticleSemiconductor Fluxes: Part 1
If you are a little intimidated by semiconductor products, this blog post provides a simple explanation to help you better understand these products.
View ArticleSemiconductor Fluxes: Part 2
This is the second in a series of posts about semiconductor fluxes, and talks about the optimal dipping depth for flip-chip fluxes.
View ArticleSemiconductor Fluxes: Part 3
Part 3 of the semiconductor flux series talks about the important cleaning function of fluxes and how thermocompression bonding can help prevent warpage and die tilt.
View ArticleWS-446HF: A One-Step Cleaning Flux
Indium Corporation’s water-soluble flux, WS-446HF, is designed to eliminate non-value-added process costs of prefluxing steps, turning “two-step soldering processes” to “one-step.”
View ArticleHow Does the Rheology of WS-446HF Enable One-Step Cleaning?
The rheology of a flux is very important with respect to the applications of a flux. WS-446HF has a stable rheology which makes it a good choice for both ball-attach and flip-chip applications.
View ArticleWS-446HF Wetting: No Substrate Is Too Tough
There are many different substrates that are used in the electronics industry, and some are more challenging to solder than others. Indium Corporation’s WS-446HF flux shows great wetting on demanding...
View ArticleCommon Ball Grid Array Failures and How to Avoid Them
The BGA ball-mount process may seem uninteresting and trivial at first glance. However, the soldering steps are complex and can lead to problematic failures. Indium Corporation's ball-attach fluxes,...
View ArticleSiP Printing 101 Webinar Preview: Water Soluble vs. No-Clean Pastes
Choosing the correct solder paste formulation is critical for System-in-Package assembly. Indium Corporation's SiPaste® solder pastes offer a complete portfolio of pastes to choose from to fit many...
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