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How Does the Rheology of WS-446HF Enable One-Step Cleaning?

The rheology of a flux is very important with respect to the applications of a flux. WS-446HF has a stable rheology which makes it a good choice for both ball-attach and flip-chip applications.

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WS-446HF Wetting: No Substrate Is Too Tough

There are many different substrates that are used in the electronics industry, and some are more challenging to solder than others. Indium Corporation’s WS-446HF flux shows great wetting on demanding...

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Common Ball Grid Array Failures and How to Avoid Them

The BGA ball-mount process may seem uninteresting and trivial at first glance. However, the soldering steps are complex and can lead to problematic failures. Indium Corporation's ball-attach fluxes,...

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SiP Printing 101 Webinar Preview: Water Soluble vs. No-Clean Pastes

Choosing the correct solder paste formulation is critical for System-in-Package assembly. Indium Corporation's SiPaste® solder pastes offer a complete portfolio of pastes to choose from to fit many...

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SiP Printing 101 Webinar Preview: Solder Paste Inspection

Just as important in the solder paste printing process is solder paste inspection; how do you know if your printer is operating optimally if your SPI machine is not doing the same? Learn more in my...

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SiP Printing 101 Webinar Preview: Stencil Technology

Stencil technology has evolved throughout the years, and System-in-Package solder pastes require specific stencil manufacturing processes and novel technology to achieve great transfer efficiency....

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Trade Show Travels June 2022

Where has the semiconductor team been traveling to this summer?

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Interconnect Reliability: From the Chip to the System

Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle from the chip to the system—from IC design, wafer fab, and...

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